STENCIL Technology and Design Workshop
Presented by Bill Coleman, Ph.D., Photo Stencil
Course Description
In this workshop you will have access to information on stencil printing performance and how stencil technology and design influences printing performance. Much of the data was generated during print performance studies at independent test laboratories. Solder volume and solder volume dispersion are the key data used to predict print performance and overall SMT assembly yields/defect rates.
Stencil designs for a variety of applications will be reviewed in detail.
A complete workbook of all information, including reference material, is provided along with a CD containing all files.
This proactive workshop will be presented in one day starting at 9:00 am, with a lunch break, and continuing until 4:00 pm. The workshop is held at the Photo Stencil, Colorado Springs facility and includes a complete tour of the facility.
All workshops are held on Friday and the 2009 schedule is as follows:
- January 23
- February 20
- March 20
- April 17
- May 15
- June 19
- July 17
- August 21
- September 25
- October 23
- November 20
- December 18
Who Should Attend
This is a hands-on workshop for process engineers, quality control engineers, supervisors, managers, and technicians who are involved with solder-paste screen printing, process control, solder paste selection, and optimizing the assembly process.
Morning Topics
Print Process and Stencil Technology
Review of important printing process parameters. The following items will be covered:
- Board variables
- Solder paste variables
- Printer variables and stencil variables
- Stencil variables will be reviewed in detail covering the stencil technologies of Electroformed Stencils, Laser Stencils and Chem-Etch Stencils
- The Print Area Ratio and its influence on solder paste release
- Aperture design guidelines and a stencil performance hierarchy
Stencil Design and Stencil Applications
This section will review the following stencil applications:
- No-clean aperture design
- SMT / Through-hole mixed technology
- Flip Chip / SMT mixed technology
- Step stencil designs
- BGA and µBGA stencil designs
- BGA repair tools
- BGA package reballing tools
- Glue stencil design and applications
- Squeegee blade considerations
- Ball drop stencils and tools (wafer level and package level)
- Wafer bumping stencils
Afternoon Topics
Lead Free Process Impacts
This section covers WEEE and RoHS complaince for suppliers to European markets. Of primary concern to most producers of printed circuit boards is finding a suitable replacement for the Pb (lead) portion of today’s solders. Topics include:
- Environmental concerns
- Legislation
- Replacement alloys
- Stencil design considerations
- Case study comparison of stencil technologies and lead-free printing
SMT Assembly and Inspection Tools
This section deals with Tools helpful in SMT Assembly. These tools include:
- Wave Solder Pallets
- SMT Process Fixtures Carriers (including Printer support and Vacuum support plates
- Full process carriers and Reflow Process Carriers)
- Press Fit Fixtures
- Conformal coat fixtures
- Test Function fixtures
- Special tooling
Component Verification Tooling is also discussed.
Intrusive Reflow
This section reviews in detail stencil designs for printing solder paste in and around through-hole locations for reflow instead of wave solder of through-hole parts. Examples of three different stencil designs will be shown along with a spreadsheet for determining stencil design to provide sufficient solder volume.
Stencil Print Performance Studies
This is a summary of a paper presented at SMTAI 2001
- Compares and ranks 4 different stencils technologies (AMTX Electroform stencil, Laser-Cut with electropolish and Nickel plating, Laser-Cut with Electropolish, and Laser-Cut with no electropolish) for paste volume, paste volume dispersion, and percentage paste release over a wide range of aperture sizes.
- A spreadsheet showing aperture size versus area ratio and recommended stencil technology based on the paste volume data will be shown.
- A guideline of recommended stencil technology for specific SMT device types is presented.
Facility Tour
Costs
- Existing Photo Stencil Customers : FREE (contact your Technical Sales Representative)
- Non-Photo Stencil Customers : $1000 (You may take full credit for this amount against Stencil or Squeegee Blade sales.)
Registration
To register for a workshop, please download the following form, fill out and email either to info@photostencil.com or to your Photo Stencil sales representative.
Registration form (Word 161K)
For More Information
Call Bill Coleman at (719) 535-8528 or e-mail at bcoleman@photostencil.com
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Photo Stencil is a proud supporter of the 2008 U.S. Senior Open
